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TLP118 2010-03-02 1 toshiba photocoupler gaa ? as ired & photo-ic TLP118 pdp (plasma display panel) fa (factory automation) interfaces of measuri ng and control instruments operate at high ambient temperatures up to 125c the toshiba TLP118 consists of gaa ? as infrared light emitting diodes and integrated high-gain, high-speed photodetectors. the TLP118 is housed in the so6 packag e. the output stage is an open collector type. the photodetector has an internal faraday shield that provides a guaranteed common-mode transient immunity of 15 kv/ s. z inverter logic type (open collector output) z package: so6 pin z guaranteed performance over: -40 to 125c z power supply voltage: 4.5 to 5.5 v z input threshold current: i fh = 5.0 ma (max) z propagation delay time t phl /t plh : 60 ns (max) z common-mode transient immunity: 15 kv/ s (min) z isolation voltage: 3750 vrms (min) z ul approved : ul1577, file no.e67349 z cul approved: csa component acceptance service no. 5a, file no.e67349 truth table input led output h on l l off h jedec D jeita D toshiba 11 ? 4l1 weight: 0.08 g (typ.) creepage distance 5.0 mm (min) clearance distance 5.0 mm (min) insulation thickness 0.4 mm (min) unit: mm 0.1 2.1 0.1 4.55 1 3 6 5 4 3.7 7.0 0.4 0.4 2.54 1.27 0.5 min 0.15 +0.25 -0.15 +0.25 -0.15 gnd 6 4 shield 3 1 5 1:anode 3:cathode 4:gnd 5:v o (output) 6:v cc v cc gnd shield 1 3 4 5 6 pin configuration (top view) schematic construction mechanical ratings v cc v o i cc i f i o free datasheet http:///
TLP118 2010-03-02 2 absolute maximum ratings (ta=25c) characteristic symbol rating unit forward current i f 25 ma forward current derating (ta 110 c) i f / c -0.67 ma/ c pulse forward current (note 1) i fp 50 ma pulse forward current derating (ta 110 c) i fp / c -1.34 ma/ c led reverse voltage v r 5 v output current 1 (ta 125 ) i o 25 ma output voltage v o 6 v supply voltage v cc 6 v output power dissipation p o 80 mw detector output power dissipation derating (ta 110 c) p o / c -2.0 mw/ c operating temperature range t opr -40 to 125 c storage temperature range t stg -55 to 125 c lead soldering temperature (10 s) t sol 260 c isolation voltage (ac,1 min.,r.h. 60%,ta=25 c) (note 2) bv s 3750 v rms note: using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc. ) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operat ing temperature/current/voltage, etc. ) are within the absolute maximum ratings. please design the appropriate reliability upon reviewing the toshiba semiconductor reliability handbook (?handling precautions?/?derating concept and methods?) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). note 1: pulse width 1ms, duty = 50%. note 2: this device is regarded as a two termi nal device: pins 1 and 3 are shorted together, as are pins 4, 5 and 6. recommended operating conditions characteristic symbol min typ. max unit input current , high level i fh 7.5 - 15 ma input voltage , low level v fl 0 - 0.8 v supply voltage* v cc 4.5 - 5.5 v operating temperature t opr -40 - 125 c * this item denotes operating range, not meaning of recommended operating conditions. note: recommended operating conditions are given as a design guideline to obtain expected performance of the device. additionally, each item is an independent guide line respectively. in developing designs using this product, please confirm specified characteristics shown in this document. free datasheet http:///
TLP118 2010-03-02 3 electrical characteristics (unless otherwise specified, ta=-40 to 125c, v cc =4.5 to 5.5 v) characteristic symbol test circuit condition min typ. max unit input forward voltage v f - i f = 10 ma , ta = 25 c 1.45 1.61 1.85 v temperature coefficient of forward voltage v f / ta - i f = 10 ma - -1.6 - mv/ c input reverse current i r - v r = 5 v , ta = 25 c - - 10 a input capacitance c t - v = 0 , f = 1 mhz, ta = 25 c - 60 - pf v f =0.8 v ,v o =5.5 v - - 250 logic high output current i oh 1 ta = 2 5 - 0.5 10 a logic low output voltage v ol 2 i f = 10 ma, i o = 13 ma (sinking) - 0.2 0.6 v logic low supply current i ccl 3 i f = 10 ma - 1.5 5 ma logic high supply current i cch 4 i f = 0 ma - 1.5 5 ma ?h level output to l level output? input current i fh - i o = 13 ma (sinking), v o < 0.6 v - 1.0 5.0 ma * all typical values are at ta=25 c, v cc =5 v unless otherwise specified isolation characteristics (ta = 25 c) characteristic symbol test condition min typ. max unit capacitance input to output c s v s = 0,f = 1 mhz (note 2) D 0.8 D pf isolation resistance r s r.h. 60%,v s = 500 v (note 2) 110 12 10 14 D ac,1 minute 3750 D D ac,1 second,in oil D 10000 D v rms isolation voltage bv s dc,1 minute,in oil D 10000 D v dc free datasheet http:///
TLP118 2010-03-02 4 switching characteristics (unless otherwise specified, ta=-40 to 125 c ? v cc =4.5 to 5.5v) characteristic symbol test circuit condition min typ. max unit propagation delay time (h l) t phl i f =0 7.5 ma - 30 60 ns propagation delay time (l h) t plh i f =7.50 ma r l =350 c l =15pf (note 4) - 30 60 ns switching time dispersion between on and off |t phl - t plh | - - 30 ns propagation delay skew (note 5) t psk i f =0 ? 7.5 ma r l =350 , c l =15pf (note 4) -40 - 40 ns fall time (90 ? 10 %) t f i f =0 7.5 ma - 30 - ns rise time (10 ? 90 %) t r 5 i f =7.50 ma r l =350 c l =15pf (note 4) - 30 - ns common mode transient immunity at high level output cm h v cm =1000 v p-p , i f =0 ma, v cc =5 v , ta=25 c 15 - - kv/ s common mode transient immunity at low level output cm l 6 v cm =1000 v p-p , i f =10 ma, vcc=5 v , ta=25 c -15 - - kv/ s *all typical values are at ta=25 c note 3: a ceramic capacitor (0.1 f) should be connected from pin 6 ( v cc ) to pin 4 (gnd) to stabilize the operation of the high gain linear amplifier. failure to prov ide the bypass may impair the switching property. the total lead length between capacitor and coupler should not exceed 1 cm. note 4: f=5mhz, duty=50%, input current tr=tf=5ns, c l is approximately 15pf which includes probe and jig/stray wiring capacitance. note 5: propagation delay skew is defined as the differ ence between the largest and smallest propagation delay times (i.e. t phl or t plh ) of multiple samples. evaluations of t hese samples are conducted under identical test conditions (supply voltage, i nput current, temperature, etc). test circuit 1: i oh test circuit test circuit 2: v ol test circuit test circuit 3: i ccl test circuit test circuit 4: i cch test circuit i f a v cc 0.1 f i ccl 0.1 f vol vcc v io shield i f shield a v cc 0.1 f i cch shield 0.1 f shield v f v cc i oh a v o free datasheet http:///
TLP118 2010-03-02 5 test circuit 5: switching time test circuit test circuit 6: common-mode tran sient immunity test circuit v o v ol t plh t phl 1.5 v 50% t f t r 90% 10% i f 0.1 f rin=100 ? *cl=15pf *cl=15pf rl=350 ? i f =7.5ma(p.g) (f=5mhz , duty=50%, tr=tf=5ns) i f monitor v o p. g. shield v cm 10% 90% 1000 v ? sw b : i f =0 ma ? sw a : i f =10 ma 0.8 v 2v v o t r t f cm l cm h sw b v cc v cm v o 0.1 f i f a rl=350 ? c l includes probe and stray capacitance. p.g.: pulse generator v cc )( )(800 s t r v h cm = )( )(800 s t f v l cm = free datasheet http:///
TLP118 2010-03-02 6 i f - v f ? v f/ ? ta - i f forward current i f (ma) 1 10 100 1 1.2 1.4 1.6 1.8 2 2.2 coefficient ? v f / ? ta ( m v / ? c) -3 -2.5 -2 -1.5 -1 0.1 1 10 100 forward voltage v f (v) forward current i f (ma) v o -i f i fh -ta output voltage v o (v) 0 1 2 3 4 5 6 0123 threshold input current i fh (ma) 0.0 1.0 2.0 3.0 4.0 5.0 -40 -20 0 20 40 60 80 100 120 140 forward current i f (ma) ambient temperature ta ( ) i ccl -ta i cch -ta low level output current i ccl (ma) 0.0 0.3 0.5 0.8 1.0 1.3 1.5 1.8 2.0 -40 -20 0 20 40 60 80 100 120 140 high level output current i cch (ma) 0.0 0.3 0.5 0.8 1.0 1.3 1.5 1.8 2.0 -40 -20 0 20 40 60 80 100 120 140 ambient temperature ta ( ) ambient temperature ta ( ) *the above graphs show typical characteristics. vcc=5v io=13ma 125?c 25?c -40?c rl=350 4k vcc=5v if=10ma vcc=5v if=0ma free datasheet http:///
TLP118 2010-03-02 7 v ol - ta t phl / t plh -ta low level output voltage v ol (v) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 -40 -20 0 20 40 60 80 100 120 140 propagation delay time tphl / tplh (ns) 0 10 20 30 40 50 60 -40 -20 0 20 40 60 80 100 120 140 ambient temperature ta ( ? c) ambient temperature ta ( ? c) *the above graphs show typical characteristics. tphl tplh vcc=5v if=10ma io=13ma(sinking) vcc=5v rl=350 if=7.5ma free datasheet http:///
TLP118 2010-03-02 8 precautions of surface mounting type photocoupler soldering & general storage (1) precautions for soldering 1) when using soldering reflow z an example of a temperature profile when sn-pb eutectic solder is used: z an example of a temperature profile when lead(pb)-free solder is used: z reflow soldering must be performed once or twice. z the mounting should be completed with the interval fr om the first to the last mountings being 2 weeks. 2) when using soldering flow (applicable to both eutectic solder and lead(pb)-free solder) z apply preheating of 150 deg.c for 60 to 120 seconds. z mounting condition of 260 deg.c or less within 10 seconds is recommended. z flow soldering must be performed once 3) when using soldering iron (applicable to both eutectic solder and lead(pb)-free solder) z complete soldering within 10 seconds for lead temperature not exceeding 260 deg.c or within 3 seconds not exceeding 350 deg.c. z heating by soldering iron must be only once per 1 lead this profile is based on the device?s maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. this profile is based on the device?s maximum heat resistance guaranteed value. set the preheat temperature/heating temperature to the optimum temperature corresponding to the solder paste type used by the customer within the described profile. free datasheet http:///
TLP118 2010-03-02 9 (2) precautions for general storage 1) do not store devices at any place where they will be exposed to moisture or direct sunlight. 2) when transportation or storage of devices, fo llow the cautions indicated on the carton box. 3) the storage area temperature should be kept within a temperature range of 5 degree c to 35 degree c, and relative humidity should be maintained at between 45% and 75%. 4) do not store devices in the pr esence of harmful (especially corrosive)gases, or in dusty conditions. 5) use storage areas where there is minimal tem perature fluctuation. be cause rapid temperature changes can cause condensation to occur on stored devices, resulting in lead oxidation or corrosion, as a result, the solderability of the leads will be degraded. 6) when repacking devices, use anti-static containers. 7) do not apply any external force or load directly to devices while they are in storage. 8) if devices have been stored for more than tw o years, even though the ab ove conditions have been followed, it is recommended that solderability of them should be tested before they are used. free datasheet http:///
TLP118 2010-03-02 10 specification for embossed?tape packing (tpl)(tpr) for so6 coupler 1. applicable package package product type so6 mini-flat coupler 2. product naming system type of package used for shipment is denoted by a symbol suffix after a product number. the method of classification is as below. (example) 3. tape dimensions 3.1 specification classification are as shown in table 1 table 1 tape type classification tape type classification quantity (pcs / reel) tpl l direction 3000 tpr r direction 3000 3.2 orientation of device in relation to direction of tape movement device orientation in the recesses is as shown in figure 1. figure 1 device orientation TLP118 (tpl) device name tape type direction of tape l direction r direction free datasheet http:///
TLP118 2010-03-02 11 3.3 empty device recesses are as shown in table 2. table 2 empty device recesses standard remarks occurrences of 2 or more successive empty device recesses 0 within any given 40-mm section of tape, not including leader and trailer single empty device recesses 6 devices (max) per reel no t including leader and trailer 3.4 start and end of tape the start of the tape has 50 or more empty holes. the end of tape has 50 or more empty holes and two empty turns only for a cover tape. 3.5 tape specification (1) tape material: plastic (protection against electrostatics) (2) dimensions: the tape dimensions are as shown in figure 2 and table 3. figure 2 tape forms table 3 tape dimensions unit: mm unless otherwise specified: 0.1 symbol dimension remark a 4.0 D b 7.6 D d 5.5 center line of indented square hole and sprocket hole e 1.75 distance between tape edge and hole center f 8.0 cumulative error (max) per 10 feed holes g 4.0 cumulative error (max) per 10 feed holes k 0 2.6 internal space +0.1 -0.3 +0.1 -0.3 0.3 0.05 2.95 0.2 k 0 g f 1.6 0.1 a e d b 12.0 0.3 1.5 +0.1 ?0 free datasheet http:///
TLP118 2010-03-02 12 3.6 reel (1) material: plastic (2) dimensions: the reel dimensions are as shown in figure 3 and table 4. figure 3 reel form table 4 reel dimensions unit: mm symbol dimension a 380 2 b 80 1 c 13 0.5 e 2.0 0.5 u 4.0 0.5 w1 13.5 0.5 w2 17.5 1.0 4. packing either one reel or five reels of photoc oupler are packed in a shipping carton. 5. label indication the carton bears a label indicating the product nu mber, the symbol representing classification of standard, the quantity, the lot num ber and the toshiba company name. 6. ordering method when placing an order, plea se specify the product number, the tape type and the quantity as shown in the following example. (example) e w1 w2 a b c u TLP118 ( tpl ) 3000 p cs device name tape type quantity (must be a multiple of 3000) free datasheet http:///
TLP118 2010-03-02 13 restrictions on product use ? toshiba corporation, and its subsidiaries and affiliates (collect ively ?toshiba?), reserve the right to make changes to the in formation in this document, and related hardware, software a nd systems (collectively ?product?) without notice. ? this document and any information herein may not be reproduc ed without prior written permission from toshiba. even with toshiba?s written permission, reproduc tion is permissible only if reproducti on is without alteration/omission. ? though toshiba works continually to improve product?s quality and reliability, product can malfunction or fail. customers are responsible for complying with safety standards and for prov iding adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a ma lfunction or failure of product could cause loss of human life, b odily injury or damage to property, including data loss or corruption. before customers use the product, create designs including the product, or incorporate the product into their own applications, cu stomers must also refer to and comply with (a) the latest versions of all relevant toshiba information, including without limitation, this document, the specifications, the data sheets and application notes for product and the precautions and condi tions set forth in the ?toshiba semiconductor reliability handbook? and (b) the instructions for the application with which the product will be us ed with or for. customers are solely responsible for all aspe cts of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this product in such design or applications; (b) eval uating and determining the applicability of any info rmation contained in this document, or in c harts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operatin g parameters for such designs and applications. toshiba assumes no liability for customers? product design or applications. ? product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measur ing equipment, industrial robots and home electroni cs appliances) or for specif ic applications as expre ssly stated in this document . product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality a nd/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or se rious public impact (?unintended use?). unintended use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic s ignaling equipment, equipment used to control combustions or explosions, safety dev ices, elevators and escalato rs, devices related to el ectric power, and equipment used in finance-related fields. do not use product for unintended use unless specifically permitted in thi s document. ? do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy product, whether in whole or in part. ? product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations. ? the information contained herein is pres ented only as guidance for product use. no re sponsibility is assumed by toshiba for an y infringement of patents or any other intellectual property rights of third parties that may result from the use of product. no license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise. ? a bsent a written signed agreement, except as provid ed in the relevant terms and conditions of sale for product, and to the maximum extent allowable by law, toshiba (1) assumes no liability whatsoever, including without limitation, indirect, co nsequential, special, or incidental damages or loss, including without limitation, loss of profit s, loss of opportunities, business interruption and loss of data, and (2) disclaims any and all express or implied warranties and conditions related to sale, use of product, or information, including warranties or conditions of merchantability, fitness for a particular purpose, accuracy of information, or noninfringement. ? gaas (gallium arsenide) is used in product. gaas is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose gaas in product. ? do not use or otherwise make available product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or m anufacturing of nuclear, chemical , or biological weapons or missi le technology products (mass destruction w eapons). product and related software and technology may be controlled under the japanese foreign exchange and foreign trade law and the u.s. expor t administration regulations. ex port and re-export of product or related software or technology are strictly prohibited exc ept in compliance with all applicable export laws and regulations. ? please contact your toshiba sales representative for details as to environmental matters such as the rohs compatibility of pro duct. please use product in compliance with all applicable laws and regula tions that regulate the inclusion or use of controlled subs tances, including without limitation, the eu rohs directive. toshiba assumes no liability for damages or losses occurring as a result o f noncompliance with applicable laws and regulations. free datasheet http:///

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